I tried desoldering using my Hakko FR-300, but the tight holes made it a difficult process, and I destroyed a (nonessential) pad even after reflowing it. After doing some research, I found that adding low-temperature solder (here, ChipQuik SMDLTLFP, melting point 138C/281F) did the trick. I was able to set the desoldering gun at its lowest setting, and ended up with clean holes.
Occasionally I'd have to go onto the component side of the board and reflow one of the power pins again, but in the end it was pretty smooth. Wiggle the pins a bit to unstick them, and they come out with only a little persuasion.
#AppleII #retrocomputing #desoldering